Wafer processing chuck using slanted clamping pins

Details Wafer processing chuck using slanted clamping pins Wafer processing chuck using slanted clamping pins

1986-04-17

1988-02-16

Schwartz, Larry I.

Drying and gas or vapor contact with solids

Apparatus

Houses, kilns, and containers

34239, 34236, 118725, 118728, 165 804, F26B 904

Patent

active

047246219

ABSTRACT:
A wafer is introduced into a processing chamber on a transport device. Lifting pins receive the wafer from the transport device and lower the wafer to the surface of a chuck. Clamping pins lower and hold the wafer by means of enlargements on the ends of the clamping pins. Grooves on the surface of the chuck and internal channels in the chuck are used to supply gas to the back of the wafer for temperature control.

REFERENCES:
patent: 3645581 (1972-02-01), Lasch, Jr. et al.
patent: 4313266 (1982-02-01), Tam
patent: 4512391 (1985-04-01), Harra
patent: 4514636 (1985-04-01), King
patent: 4565601 (1986-01-01), Kakehi et al.

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