Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2005-11-22
2005-11-22
Nguyen, Vinh P. (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S755090, C438S017000
Reexamination Certificate
active
06967497
ABSTRACT:
The present invention includes an electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus. One embodiment of an electronic device workpiece processing apparatus includes a chuck including a surface, an electrical coupling adjacent the surface, and electrical interconnect configured to connect with the electrical coupling of the chuck and conduct a signal within the chuck; an intermediate member having a first surface and a second surface and the intermediate member including: an electrical coupling adjacent the first surface and configured to couple with the electrical coupling of the chuck; an electrical coupling adjacent the second surface; and an electrical interconnect configured to connect the electrical coupling adjacent the first surface and the electrical coupling adjacent the second surface; and an electronic device workpiece configured to couple with the second surface of the intermediate member, the electronic device workpiece including a sensor and an electrical coupling configured to provide electrical connection of the sensor with the electrical coupling of the second surface of the intermediate member.
REFERENCES:
patent: 3440407 (1969-04-01), Golstos et al.
patent: 3614345 (1971-10-01), Quinn
patent: 3683306 (1972-08-01), Bulthius et al.
patent: 3710251 (1973-01-01), Hagge et al.
patent: 4006909 (1977-02-01), Ollendorf et al.
patent: 4104589 (1978-08-01), Baker et al.
patent: 4332081 (1982-06-01), Francis
patent: 4355463 (1982-10-01), Burns
patent: 4518944 (1985-05-01), Faris
patent: 4560216 (1985-12-01), Egawa
patent: 4703555 (1987-11-01), Hubner
patent: 4756555 (1988-07-01), Bachmann
patent: 4912600 (1990-03-01), Jaeger et al.
patent: 5141334 (1992-08-01), Castles
patent: 5325052 (1994-06-01), Yamashita
patent: 5347869 (1994-09-01), Shie et al.
patent: 5378311 (1995-01-01), Nagayama et al.
patent: 5406109 (1995-04-01), Whitney
patent: 5436646 (1995-07-01), Schilling et al.
patent: 5437189 (1995-08-01), Brown et al.
patent: 5438494 (1995-08-01), Harlan
patent: 5446437 (1995-08-01), Bantien et al.
patent: 5475317 (1995-12-01), Smith
patent: 5478242 (1995-12-01), Walker et al.
patent: 5492011 (1996-02-01), Amano et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5503034 (1996-04-01), Amano et al.
patent: 5550526 (1996-08-01), Mottahed
patent: 5551283 (1996-09-01), Manaka et al.
patent: 5612574 (1997-03-01), Summerfelt et al.
patent: 5645764 (1997-07-01), Angelopoulos et al.
patent: 5670066 (1997-09-01), Barnes et al.
patent: 5703287 (1997-12-01), Treutler et al.
patent: 5719333 (1998-02-01), Hosoi et al.
patent: 5830372 (1998-11-01), Hierold
patent: 5831333 (1998-11-01), Malladi et al.
patent: 5886863 (1999-03-01), Nagasaki et al.
patent: 5919548 (1999-07-01), Barron et al.
patent: 5945834 (1999-08-01), Nakata et al.
patent: 5964395 (1999-10-01), Glovatsky et al.
patent: 5969639 (1999-10-01), Lauf et al.
patent: 6004471 (1999-12-01), Chuang
patent: 6020750 (2000-02-01), Berger et al.
patent: 6645701 (2000-11-01), Ota et al.
patent: 6377060 (2002-04-01), Burkhart et al.
patent: 6635852 (2003-10-01), Seiwa
patent: 6709878 (2004-03-01), Akram et al.
patent: 2336778 (1977-07-01), None
patent: 56-12521 (1981-02-01), None
patent: 2-268462 (1990-11-01), None
S/N: 09/032,184; Filed Feb. 27, 1998; Akram et al.; Amendment filed Dec. 18, 2000; CPA filed Jun. 28, 2000; Amendment filed Mar. 3, 2000: Amendments filed Aug. 23, 1999; Original Application filed Feb. 27, 1998; Pending Claims.
Advertisement for Probe Technology; www.idinet.com; Interconnect Devices, Inc., 1 page; Mar. 6, 1998.
Good Things Come In Small BGA/CSP Packages: www.johnstech.com/4/handbook/page9.html; 1 page; Mar. 5, 1998.
Product Description for Double Ended Probes, B1052 Series; www. testprobe.com/products/b1052.html; Rika Denshi America, Inc.; 1 page; Feb. 4, 1998.
Product Description for Test Centers, RM-500 Series Probes, www.testprobe.com/products/rm500.html; Rika Denshi America, Inc.; 1 page; Feb. 4, 1998.
Product Descrpition for Cost Effective Interconnections for High I/O Products; ww.testprobe.com/products/io.htm#b1303; Rika Denshi America, Inc.; 1 page; Feb. 4, 1998.
Product Description for Ball Grid Probe B1303-C3; www.testprobe.com/products/io.htm#b1303; Rika Denshi America, Inc.; 1 page; Feb. 4, 1998.
Product Description for Test Socket Contacts; www.johnstech.com/4/handbook/page9.html; 1 page; Mar. 5, 1998.
“Application Guide Temperature Sensors”, Watlow Electrical Manufacturing Company Catalog, pp. 775-778, 1992/1993.
“In-Situ survey System of Resistive and Thermoelectric Properties of Either Pure or Mixed Materials in Thin Films Evaporated Under Ultra High Vacuum”, Lechervallier, LeHuerou, Richon, Sarrau, & Gouault, J. Phys. III France, vol. 5, pp. 409-418, Apr. 1995 (Abstract only).
“Temperature Metrology for CD Control in DUV Lithography”, Jeffrey Parker and Wayne Renken, pp. 111-112, 114, 116, Sep. 17, 1997.
“NTC and PTC Thermistors”; http://www.thermodisc.com
tcptc.html; Jan. 7, 1998; 2 pages.
“DI-5B35 Linearized 4-Wire RTD Input”; ; http://www.dataq.com/di5b35.html; Jan. 7, 1998: 2 pages.
“RTD”; http://www.mtisensors.com/rtds.html; Jan. 7, 1998; 3 pages.
“Low Cost Thermal-Ribbon (TM) uses thin film RTD”; http://www.minco.com/s17624nr.html; Jan. 7, 1998; 1 page.
“Silicon Processing for the VLSI Era”; vol. 1—Process Technology; Second Edition; S. Wolf et al.; 2000; pp. 22-25 and pp. 841-845.
Micro)n Technology, Inc.
Nguyen Vinh P.
Wells St. John P.S.
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