Abrading – Machine – Rotary tool
Patent
1997-09-26
1999-11-02
Rose, Robert A.
Abrading
Machine
Rotary tool
451398, B24B 722
Patent
active
059759984
ABSTRACT:
Wafer processing apparatus for batch processing of wafers comprises a turntable, having a polishing surface thereon, capable of rotation about a turntable rotation axis. A pressure plate is constructed for simultaneously holding multiple wafers with a polish face of the wafers facing the polishing surface of the turntable. A polisher head capable of applying a normal force to the pressure plate is provided to drive the pressure plate toward the turntable so that the polish face of the wafers engages the polishing surface of the turntable for polishing of the wafers. A force distributing member intermediate the polisher head and the pressure plate is constructed for uniformly distributing the force applied by the polisher head to the pressure plate.
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MEMC Electronic Materials , Inc.
Rose Robert A.
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