Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1991-07-29
1992-12-15
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156639, 156640, 156643, H01L 21306, B44C 122
Patent
active
051713934
ABSTRACT:
A semiconductor wafer processing station comprising a plasma etching unit, a wet processing spin-spray unit, a robotic wafer transfer arm, and a central control computer all contained in a single housing. The apparatus is designed to perform manufacturing tasks especially related to photoresist processing: photoresist developing, descumming, baking and hardening, and stripping. The apparatus follows preprogrammed instructions which allow the station to automatically perform wafer processing routines by removing wafers from a storage cassette, then transferring the wafers to the processing unit with the robotic arm. Custom processing procedures are programmable, allowing practical small-scale low volume wafer development. Wafer processing routines envisioned include photoresist application and developing, plasma etching and descumming, and procedures involving multiple processing steps utilizing both the plasma/oven unit and the wet chemical spin-spray unit. Such routines would perform precision etching or serve to remove contaminants produced in the photoresist processing procedures.
REFERENCES:
patent: 4161356 (1979-07-01), Giffin et al.
patent: 4715921 (1987-12-01), Maher et al.
patent: 4875989 (1989-10-01), Davis et al.
patent: 4908095 (1990-03-01), Kagatsume et al.
patent: 4971653 (1990-11-01), Powell et al.
patent: 4986877 (1991-01-01), Tachi et al.
patent: 4992136 (1991-02-01), Tachi et al.
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