Cleaning and liquid contact with solids – Apparatus – With movably or flexibly mounted spray or jet applying...
Patent
1997-07-07
1999-03-30
Coe, Philip R.
Cleaning and liquid contact with solids
Apparatus
With movably or flexibly mounted spray or jet applying...
134184, 134199, 134902, B08B 312
Patent
active
058876073
ABSTRACT:
A wafer processing apparatus is provided and includes a wafer carrier positioned in a processing vessel and arranged to support a plurality of wafers within the processing vessel such that the wafers define respective wafer gaps between adjacent wafers. A drive assembly is arranged to position respective processing plates in the respective wafer gaps such that respective major plate surfaces oppose respective major wafer surfaces. The processing plates are arranged to initiate a wafer processing operation.
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"Megasonics" http://clean.rti.org/me-gen.htm, Mar. 20, 1997.
"Silicon Processing For the VLSI Era" by Stanley Wolf Ph.D., (Lattice Press) pp. 514-520.
"Microchip Fabrication" by Peter Van Zant, (McGraw-Hill) pp. 172-182.
Korn Dave
Malinowski Darrin
Coe Philip R.
Micro)n Technology, Inc.
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