Wafer processing apparatus

Details Wafer processing apparatus Wafer processing apparatus

2005-01-11

2005-01-11

Lu, Jiping (Department: 3749)

Heating

With work cooling structure

C432S128000, C432S250000, C118S724000

Reexamination Certificate

active

06840763

ABSTRACT:
A wafer processing system which requires no isolation between the operational areas within the processing system. The system of the present invention includes operational areas, such as a loading area, a transport area, and a reactor or thermal processing area. Advantageously, since there are no isolation devices or gate valves separating the areas, the processing system effectively has each operational area combined into a “single” chamber. Preferably, the single chamber has a single slit valve, hinge door, or other vacuum sealable door disposed proximate to the loading area to allow for the removal/insertion of the wafers into the loading area. Once the door to the loading area has been closed the internal pressure within the chamber can be kept uniform throughout each operational area.

REFERENCES:
patent: 4680451 (1987-07-01), Gat et al.
patent: 4886954 (1989-12-01), Yu et al.
patent: 5114242 (1992-05-01), Gat et al.
patent: 5155336 (1992-10-01), Gronet et al.
patent: 5165796 (1992-11-01), Gat et al.
patent: 5208643 (1993-05-01), Fair
patent: 5317492 (1994-05-01), Gronet et al.
patent: 5418885 (1995-05-01), Hauser et al.
patent: 5443382 (1995-08-01), Tsurumi et al.
patent: 5584936 (1996-12-01), Pickering et al.
patent: 5639301 (1997-06-01), Sasada et al.
patent: 5645419 (1997-07-01), Ohsawa et al.
patent: 5654417 (1997-08-01), Tarr et al.
patent: 5654904 (1997-08-01), Thakur
patent: 5715361 (1998-02-01), Moslehi
patent: 5830277 (1998-11-01), Johnsgard et al.
patent: 5837555 (1998-11-01), Kaltenbrunner et al.
patent: 5872889 (1999-02-01), Kaltenbrunner et al.
patent: 6099598 (2000-08-01), Yokohama et al.
patent: 0 516 316 (1992-12-01), None
patent: 0 843 343 (1998-05-01), None
patent: 0 847 076 (1998-06-01), None
“Rapid Thermal Processing: Equipment, Technology, and Process”, American Vacuum Society/New Mexico Chapter, C.B. Yarling, May 23, 1997.

Affiliated with

Also associated with

Rating

Wafer processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer processing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3438849