Wafer process tube apparatus and method for vertical furnaces

Details Wafer process tube apparatus and method for vertical furnaces Wafer process tube apparatus and method for vertical furnaces

1993-05-21

1994-06-07

Bueker, Richard

Coating apparatus

Gas or vapor deposition

156345, 4272481, C23C 1600

Patent

active

053186320

ABSTRACT:
A cap inserted into a wafer process tube for vertical furnaces is provided with exhaust flow normalizing means which can control or prevent variations in exhaust flow rates in the process tube, and thereby control variations in thickness of wafers subjected to film forming and annealing.
In the alternative, an annular hollow ring is hermetically sealed around an outer circumferential surface of the process tube. An exhaust pipe is connected to the hollow annular ring. Gas communication holes are formed in the wall of the process tube to accommodate the flow of gas between the tube and the hollow annular ring. The spacing and cross-sectional area of the communication holes are such as to equalize flow resistance circumferentially around the cap. In-plane variations and wafer to wafer variations in thickness and quality of wafers subjected to film forming and annealing thereby are reduced and controlled.

REFERENCES:
patent: 4640223 (1987-02-01), Dozier

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