Wafer probing test apparatus and method of docking the test...

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

Reexamination Certificate

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C324S758010

Reexamination Certificate

active

06894480

ABSTRACT:
Wafer probing test apparatus includes a main body, a test head having a plurality of pogo pins at its bottom surface, a probe card for engagement with the test head, a position sensor for sensing when the test head is oriented properly for docking with the probe card, and a docking height sensor for sensing when the test head arrives at the proper docking height. The sensors include a plurality of position sensor protrusions and at least one height sensor protrusion formed on the bottom of the test head, a plurality of position limit switches and a down limit switch. The switches are operated in response to the insertion and withdrawal of the position sensor protrusions into and from holes formed in the probe card.

REFERENCES:
patent: 5241870 (1993-09-01), Holt
patent: 5404111 (1995-04-01), Mori et al.
patent: 5642056 (1997-06-01), Nakajima et al.
patent: 5656942 (1997-08-01), Watts et al.
patent: 6111419 (2000-08-01), Lefever et al.
patent: 64-053428 (1989-01-01), None
patent: 11-030647 (1999-02-01), None
patent: 10-0240476 (1999-10-01), None

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