Wafer probecard interface

Details Wafer probecard interface Wafer probecard interface

2006-07-04

2006-07-04

Nguyen, Vinh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090, C324S758010, C439S066000

Reexamination Certificate

active

07071724

ABSTRACT:
Apparatus and method for testing a device wafer having a plurality of devices formed thereon. One embodiment of the invention provides an interface wafer comprising a plurality of contact pads disposed on a first surface for contacting a plurality of device pads on the device wafer and a plurality of interface pads disposed on a second surface for contacting probe needles on a probe card, wherein the plurality of interface pads are electrically connected to the plurality of contact pads and wherein the plurality of interface pads are disposed in a relaxed-pitch arrangement as compared to the plurality of contact pads.

REFERENCES:
patent: 6624646 (2003-09-01), Zaiser
patent: 6707065 (2004-03-01), Fenner et al.
patent: 6812718 (2004-11-01), Chong et al.
patent: 6847218 (2005-01-01), Nulty et al.
patent: 2002/0132501 (2002-09-01), Eldridge et al.
patent: 2004/0223309 (2004-11-01), Haemer et al.

Affiliated with

Also associated with

Rating

Wafer probecard interface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer probecard interface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer probecard interface will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3571568