Wafer probe station for low-current measurements

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324758, 324761, 324762, G01R 3102, G01R 1073

Patent

active

056636539

ABSTRACT:
A wafer probe station adapted for low-current measurements provides electrically active upper and lower chuck assembly elements where air gaps are provided between a major portion of either a lower or nonlower surface on the upper chuck assembly element and a corresponding conductive surface on or connected to the lower chuck assembly element thereby minimizing leakage currents therebetween. The chuck assembly elements are preferably enclosed by an environment control enclosure having a sidewall portion relative to which the upper chuck assembly element can move laterally. During such movement, the upper chuck assembly remain in constant spacing with a conductive member that laterally surrounds it so as to stabilize electromagnetic conditions. Concurrently, the sidewall portion is kept motionless relative to the probe holder which keeps contaminants away from the region immediate to the upper chuck assembly element, including any moisture droplets that have condensed during low-temperature testing. Modularity of the chuck assembly elements is preferably facilitated by detachable electrical connections. Preferably, the lower chuck assembly element, the conductive member and an upper guard plate surround the upper chuck assembly element for guarding thereof so as to further minimize leakage currents and reduce settling times.

REFERENCES:
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patent: 5077523 (1991-12-01), Blanz
patent: 5084671 (1992-01-01), Miyata et al.
patent: 5220277 (1993-06-01), Reitinger
"Model TP03000 Series Thermochuck.RTM. Systems," four-page product note, Temptronic Corporation, Newton, MA (May 1992 or earlier).
"Application Note 1 Controlled Environment Enclosure," two-page application note, Temptronic Corporation, Newton, MA (May 1992 or earlier).
"S-1240," two-page product note, Signatone, San Jose, CA (Feb. 1988 or earlier per Signatone counsel).
"Cross Section Signatone S-1240." one-page sketch prepared by Signatone counsel, Signatone, San Jose, CA (Feb. 1988 or earlier per Signatone counsel).
Article by William Knauer entitled "Fixturing for Low-Current/Low Voltage Parametric Testing," appearing in Evaluation Engineering, Nov. 1990, pp. 150-153.
Hewlett-Packard, "Application Note 356-HP 4142B Modular DC Source/Monitor Practical Application," (Nov. 1987) pp. 1-4.
Hewlett-Packard, H-P Model 4284A Precision LCR Meter, Operation Manual (Dec. 1991) pp. 2-1, 6-9, and 6-15.
Article by Yousuke Yamamoto, entitled "A Compact Self-Shielding Prober for Accurate Measurement of On-Wafer Electron Devices," appearing in IEEE Transactions on Instrumentation and Measurement, vol. 38, No. 6, Dec. 1989, pp. 1088-1093.
Temptronic's "Guarded" Chuck, one-page note describing guarding system of Temptronic Corporation of Newton, Massachusetts, dated Nov. 15, 1989.
Beck & Tomann, "Chip Tester," IBM Technical Disclosure Bulletin, p. 4819 (Jan. 1985).

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