Wafer probe head

Details Wafer probe head Wafer probe head

1987-06-02

1988-06-07

Eisenzopf, Reinhard J.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324158F, 324 73PC, G01R 3102, G01R 106

Patent

active

047499427

ABSTRACT:
A wafer probe head has a plate-form support member having a tip region and a mounting region. At least one electrically conductive probe tip is carried by the support member at the tip region. A connector is carried by the support member at a location spaced from the tip region, and the probe tip is electrically connected to the connector. The probe head also has a strain gauge for measuring physical distortion of the support member as a result of the probe tip being pressed against a device under test by virtue of relative movement between the mounting region of the support member and the device under test.

REFERENCES:
patent: 3446065 (1969-05-01), Wiesler et al.
patent: 3849728 (1974-11-01), Evans
patent: 4116523 (1978-09-01), Coberly et al.
patent: 4219771 (1980-08-01), Reid et al.
patent: 4574235 (1986-03-01), Kelly et al.
patent: 4686463 (1987-08-01), Logan
Bailey et al.; "A Neutron Hardness Assurance Screen Based on High Frequency Probe Measurements"; IEEE Transactions on Nuclear Science, vol. NS. 23, No. 6, Dec. 1976; p. 2023.
Byrnes et al., "Self Measurement of Probe Deflection in a Semiconductor Test System", IBM Technical Disclosure Bulletin; vol. 20, No. 1, Jun. 1977; p. 166.
"Introducing the World's first Microwave Wafer probing Equipment"; Cascade Microwave; 1983; pp. 1-3.

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