Wafer prealigner using pulsed vacuum spinners

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364489, 318640, 356400, 358101, 406 87, B65G 4724, B65G 5102

Patent

active

044660731

ABSTRACT:
Wafer alignment apparatus includes an aligner platform having defined thereon X and Y axes and a desired rotational orientation for a wafer. A first vacuum spinner is supported for rotation in the platform about the intersection of the X and Y axes and second and third spinners are provided displaced from the intersection of the axes. Two edge sensors, for sensing the desired wafer edge location at two points separated from each other, and edge or notch sensors for sensing rotational alignment of said wafer provide inputs to logic means which provide outputs to the vacuum spinners for carrying out a series of individual rotations to align the wafer.

REFERENCES:
patent: 3930684 (1976-01-01), Lasch et al.
patent: 4242038 (1980-12-01), Santini et al.
patent: 4301470 (1981-11-01), Pagany
patent: 4328553 (1982-05-01), Fredriksen et al.
patent: 4362385 (1982-12-01), Lobach

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