Wafer positioning method and device, wafer process system,...

Details Wafer positioning method and device, wafer process system,... Wafer positioning method and device, wafer process system,...

2008-01-01

2008-01-01

Punnoose, Roy M. (Department: 2886)

Optics: measuring and testing

By alignment in lateral direction

Reexamination Certificate

active

10495563

ABSTRACT:
In wafer positioning by moving a center point (0) of a wafer (21) to a given position and orienting a notch part (21a) of the wafer in a given direction, wafer seat drive means (2,3,8, or9) positions a rotation axis (B) of a wafer seat (16) on a straight line which passes through a center part of a line sensor (4) and extends in the extending direction thereof, and rotates the wafer seat on which the wafer lies around the rotation axis; calculation means (24) finds a wafer notch part position and a maximum or minimum eccentric radius of the wafer based on a rotation angle of the wafer seat and detection results of an outer periphery edge of the wafer lying on the wafer seat by the line sensor, and, from the obtained results, geometrically calculates a rotation axis position and a rotation angle of the wafer when the wafer center point is at the given position and the wafer notch part is oriented in the given direction; and the wafer seat drive means (2, 3, 8, or9) moves, rotates, and stops the wafer seat (16) so that a rotation axis position and a rotation angle of the wafer seat correspond to the calculated rotation axis position and the calculated rotation angle. In result, speed and precision in a wafer positioning operation can be thereby improved.

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