Wafer positioning apparatus

Material or article handling – Article reorienting device – Orienter has article gripping means

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Details

29833, 108 20, 269 21, 269 71, 414749, 414754, B25J 1500

Patent

active

050549910

ABSTRACT:
The wafer positioning apparatus has an X.multidot.Y axis drive mechanism for moving a mounting stock in the X-axis direction and the Y-axis direction in the X.multidot.Y coordinates on the horizontal plane; a wafer inserting section is fixed on the mounting stock and has a space for inserting a wafer horizontally; photosensors are installed at the wafer inserting section and arranged at regular intervals on positions corresponding to peripheral portions of the wafer so as to detect edge portions of the inserted wafer; and a rotary section is arranged at the center of the wafer inserting section to be attached to the center of the rear surface of the inserted wafer by suction. The wafer is held on a hand plate or the like of a separate carrier system and inserted horizontally into the center of the space within the wafer inserting section, and the photosensors act in this state and detect peripheral portions of the wafer, and at the same time the X.multidot.Y axis drive mechanism acts to move the mounting stock with the wafer inserting section in the X-axis direction and the Y-axis direction in response to detection by photocells so that the center position of the wafer inserting section and the center position of the wafer are registered. The wafer is then attached to the rotary section and rotated to proper angular position in response to detection of edge portions by the photosensors.

REFERENCES:
patent: 3881605 (1975-05-01), Grossman
patent: 4695215 (1987-09-01), Jacoby et al.
patent: 4729536 (1988-03-01), Scala
patent: 4770600 (1988-09-01), Ishikawa

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