Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1998-01-06
1999-10-26
Kunemund, Robert
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
451 6, 451 41, B24B 4904
Patent
active
059721626
ABSTRACT:
A probe assembly is provided for semiconductor wafer polishing and similar wafer treatments. The polishing table forms a recess for receiving the probe, with the probe free end located to view interior portions of a semiconductor wafer temporarily passing over the recess. Probe data may conveniently be used for polishing end point determination.
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Ahmed Shamim
Kunemund Robert
Speedfam Corporation
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