Wafer polishing with improved backing arrangement

Details Wafer polishing with improved backing arrangement Wafer polishing with improved backing arrangement

1998-05-15

2000-11-07

Eley, Timothy V.

Abrading

Machine

Rotary tool

451398, 451288, 451287, 451 41, B24B 2900

Patent

active

061428574

ABSTRACT:
A wafer carrier includes a porous media layer through which a pressurized fluid is injected. The porous media layer introduces lateral dispersion into the pressurized flow, thereby assuring a uniform pressure at the exit surface of the porous media layer, as when the porous media layer is located adjacent the wafer being polished. Alternatively, an inflatable bladder may be introduced between the porous media layer and the wafer, again with pressure being maintained uniform by the porous media layer.

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PCT Search Report for Application No. PCT/US99/05906.
Murakami et al., "Long Run Planarity and Uniformity Performance of CMP on Single Hard Pad With Air--Backed Carrier and In-Situ Pad Profile Control", Jun. 18-20, 1996 VMC Conerence, pp. 413-418.
Hayashi et al., "Ultrauniform Chemical Mechanical Polishing (CMP) Using A `Hydro-Chuck` , Featured By Wafer Mounting On A Quartz Glass Plate With fully Flat, Water Supported Surface", Jpn. J. Appl. Phys. vol. 35 (1996), pp. 1054-1059, Part 1, No. 28, Feb. 1996.

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