Wafer polishing method and wafer polishing apparatus in...

Details Wafer polishing method and wafer polishing apparatus in... Wafer polishing method and wafer polishing apparatus in...

2005-06-14

2005-06-14

Hassanzadeh, P. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C134S114000, C451S066000

Reexamination Certificate

active

06905571

ABSTRACT:
When honing an abrasive pad for polishing a wafer by rotating while closely contacting the wafer by bringing a conditioner into contact with the abrasive pad, forces applied from the abrasive pad to the conditioner are detected by a plurality of pressure detectors through a conditioner driving unit for holding the conditioner. The pressure detectors are respectively able to detect forces in two directions such as rotational direction and radial direction. A memory stores correlations between detection values and wafer polishing quantities under various conditioning terms. Therefore, it is determined whether the detection values are kept within acceptable limits stored in the memory. When the values are out of the acceptable limits, a controller controls the values so that they fall within the acceptable limits by properly changing conditioning terms.

REFERENCES:
patent: 6191038 (2001-02-01), Yoshida et al.
patent: 6269510 (2001-08-01), Beardsley et al.
patent: 6561875 (2003-05-01), Homma et al.
patent: 6722948 (2004-04-01), Berman
patent: 2000-202758 (2000-07-01), None
patent: 2001-252859 (2001-09-01), None
patent: 2002-086342 (2002-03-01), None
patent: 2000-117615 (2003-04-01), None

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