Wafer polishing method and apparatus

Details Wafer polishing method and apparatus Wafer polishing method and apparatus

2008-12-17

2011-11-29

Rachuba, Maurina (Department: 3727)

Abrading

Abrading process

Glass or stone abrading

C451S056000, C451S285000, C451S443000

Reexamination Certificate

active

08066550

ABSTRACT:
A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished. Finally, the polishing unit is lowered to make the lower surface of the polishing member into pressure contact with the peripheral portion of the wafer, thus polishing only the peripheral portion.

REFERENCES:
patent: 5476413 (1995-12-01), Hasegawa et al.
patent: 5727990 (1998-03-01), Hasegawa et al.
patent: 6511362 (2003-01-01), Akaike et al.
patent: 2001/0034194 (2001-10-01), Hakomori
patent: 2002/0182985 (2002-12-01), Shiino et al.
patent: A 2003-53662 (2003-02-01), None

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