Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2007-11-06
2007-11-06
Rachuba, M. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S041000, C451S057000, C451S059000
Reexamination Certificate
active
10523976
ABSTRACT:
The present invention provides a wafer polishing method and a polishing apparatus which are capable of preventing peripheral sags of a wafer due to polishing and then manufacturing the wafer, especially an SOI wafer at a high flatness level. There is provided a wafer polishing method using a polishing apparatus which comprises a rotatable table having a polishing cloth adhered thereon and a polishing head equipped with a wafer holding plate opposing to the table and in which the back surface of the wafer is held by a holding surface of the wafer holding plate and the front surface of the wafer is pressed to and polished by the polishing pad, comprising a polishing step of polishing the front surface of the wafer to a predetermined total polishing stock removal without changing the polishing apparatus, wherein the polishing step is divided into plural sub-steps and a holding position of the wafer in a subsequent sub-step is different from a holding position of the wafer in a previous sub-step.
REFERENCES:
patent: 4373991 (1983-02-01), Banks
patent: 4662811 (1987-05-01), Hayden
patent: 5398459 (1995-03-01), Okumura et al.
patent: 5738568 (1998-04-01), Jurjevic et al.
patent: 5762539 (1998-06-01), Nakashiba et al.
patent: 6372593 (2002-04-01), Hattori et al.
patent: 6465316 (2002-10-01), Hattori et al.
patent: 6533646 (2003-03-01), Volodarsky
patent: 6623329 (2003-09-01), Moore
patent: 2001/0029155 (2001-10-01), Bennett et al.
patent: 11-188619 (1999-07-01), None
patent: 2000-094316 (2000-04-01), None
patent: 2002-503044 (2002-01-01), None
patent: WO-99/41022 (1999-08-01), None
English language abstract of JP 11 188619.
International Search Report for PCT/JP03/09658 mailed on Nov. 18, 2003.
Rachuba M.
Rader & Fishman & Grauer, PLLC
Shin-Etsu Handotai & Co., Ltd.
LandOfFree
Wafer polishing method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer polishing method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer polishing method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3848302