Wafer polishing method and apparatus

Details Wafer polishing method and apparatus Wafer polishing method and apparatus

1994-07-15

1996-03-12

Rose, Robert A.

Abrading

Machine

Rotary tool

451290, 451 66, B24B 722

Patent

active

054981999

ABSTRACT:
A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

REFERENCES:
patent: 4141180 (1979-02-01), Gill, Jr. et al.
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 5329732 (1994-07-01), Karlsrud et al.

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