Wafer polishing method and apparatus

Details Wafer polishing method and apparatus Wafer polishing method and apparatus

1994-05-18

1996-03-12

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

451 24, B24B 3704, B24B 722

Patent

active

054981964

ABSTRACT:
A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

REFERENCES:
patent: 3128580 (1964-04-01), Davis
patent: 4194324 (1980-03-01), Bonora et al.
patent: 5035087 (1991-07-01), Nishiguchi et al.

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