Wafer polishing method and apparatus

Details Wafer polishing method and apparatus Wafer polishing method and apparatus

1992-06-15

1994-07-19

Rose, Robert A.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51132, 51215CP, 51215UE, B24B 722

Patent

active

053297326

ABSTRACT:
A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

REFERENCES:
patent: 3611654 (1971-10-01), Weber et al.
patent: 3857123 (1974-12-01), Walsh
patent: 4141180 (1979-02-01), Gill, Jr. et al.
patent: 4193226 (1980-03-01), Gill, Jr. et al.
patent: 4811522 (1989-03-01), Gill, Jr.
patent: 4863395 (1975-02-01), Brown
patent: 4918870 (1990-04-01), Torbert et al.
patent: 4944119 (1990-07-01), Gill, Jr. et al.
patent: 5095661 (1992-03-01), Gill, Jr. et al.

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