Wafer polishing method

Details Wafer polishing method Wafer polishing method

2008-09-22

2011-11-08

Vinh, Lan (Department: 1713)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S113000, C438S690000, C216S020000

Reexamination Certificate

active

08053367

ABSTRACT:
A wafer polishing method is provided. First, a wafer, having a first surface, a second surface, and a plurality of opening portions depressed on the first surface, is provided. A plastic adhesive is filled in the opening portions and cured later. A polishing step is performed to thin the thickness of the wafer. Therefore, the yield of the wafer in the polishing process can be improved by the protection of the plastic adhesive.

REFERENCES:
patent: 5776799 (1998-07-01), Song et al.
patent: 6703075 (2004-03-01), Lin et al.
patent: 7217640 (2007-05-01), Kurosawa et al.
patent: 2005/0009366 (2005-01-01), Moore

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