Wafer polishing method

Details Wafer polishing method Wafer polishing method

2006-03-21

2006-03-21

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S054000, C451S063000

Reexamination Certificate

active

07014536

ABSTRACT:
A wafer polishing method which can prevent polishing swarfs from entering the gap between the periphery of a wafer and a protective tape when the back surface of the wafer is dry polished with a polishing pad after the protective tape is affixed onto the front surface of the wafer, the method comprising the steps of cutting an arcuate chamfered portion formed at the periphery of the wafer to form a precipice at the periphery of the wafer; affixing the protective tape onto the surface to be held on the chuck table of a polishing machine, of the wafer; and placing the wafer on the chuck table in such a manner that the side of the protective tape comes into contact with the chuck table to dry polish the surface of the wafer with a polishing means.

REFERENCES:
patent: 2003/0104765 (2003-06-01), Maeda et al.
patent: 2003/0199238 (2003-10-01), Moriyama et al.
patent: 2003-71714 (2003-03-01), None

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