Abrading – Machine – Endless band tool
Patent
1994-11-02
1996-09-24
Meislin, D. S.
Abrading
Machine
Endless band tool
451490, B24B 2100
Patent
active
055585680
ABSTRACT:
A semi-conductor wafer polishing machine having a polishing pad assembly and a wafer holder includes a support positioned adjacent the polishing pad assembly. The support includes multiple fluid bearings that support the polishing pad assembly on the support. These fluid bearings are arranged concentrically to provide concentric regions of support for the polishing pad assembly, and each fluid bearing is coupled to a respective source of pressurized fluid at a respective pressure.
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Nagorski Boguslaw A.
Talieh Homayoun
Weldon David E.
Meislin D. S.
OnTrak Systems, Inc.
Weinberg Andrew
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