Wafer polishing machine

Details Wafer polishing machine Wafer polishing machine

1997-07-24

1999-08-03

Rose, Robert A.

Abrading

Machine

Rotary tool

451446, 451398, 451443, B24B 722

Patent

active

059317256

ABSTRACT:
A semiconductor wafer is held by a wafer mount plate, which is loosely inserted into a housing. An air chamber is formed between the wafer mount plate and the housing. A retainer ring encloses the semiconductor wafer, and the semiconductor wafer as well as the retainer ring contacts with a polishing pad. An roughness is formed at the bottom of the retainer ring so as to dress the polishing pad. Polishing liquid is supplied to the inside of the retainer ring. Thus, the polishing pressure can be uniformly applied and the polishing liquid can be uniformly supplied on the whole surface of the semiconductor wafer, and the polishing for the semiconductor wafer and the dressing for the polishing pad can be performed at the same time.

REFERENCES:
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5527209 (1996-06-01), Volodarsky et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5643061 (1997-07-01), Jackson et al.
patent: 5681215 (1997-10-01), Sherwood et al.
patent: 5695392 (1997-12-01), Kim

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