Wafer polishing apparatus and wafer polishing method

Details Wafer polishing apparatus and wafer polishing method Wafer polishing apparatus and wafer polishing method

2008-10-06

2011-10-25

Rachuba, Maurina (Department: 3727)

Abrading

Abrading process

Glass or stone abrading

C451S056000, C451S060000

Reexamination Certificate

active

08043140

ABSTRACT:
A wafer polishing in which a polishing liquid is supplied to a polishing pad for polishing a wafer carried on a carrier head; and the polishing liquid is supplied from one or more polishing liquid supplying devices onto the polishing pad, by a polishing liquid supplying member of the polishing liquid supplying device being positioned close to or in contact with the polishing pad, and is relatively moved against the polishing pad, so that the polishing liquid supplied to the upper portion of the polishing liquid supplying member flows down along the polishing liquid supplying member to be painted on a surface of the polishing pad.

REFERENCES:
patent: 4102299 (1978-07-01), Wallstén
patent: 4222342 (1980-09-01), Johansson et al.
patent: 4907426 (1990-03-01), Wood et al.
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5868863 (1999-02-01), Hymes et al.
patent: 5885147 (1999-03-01), Kreager et al.
patent: 5928062 (1999-07-01), Miller et al.
patent: 6139406 (2000-10-01), Kennedy et al.
patent: 6193587 (2001-02-01), Lin et al.
patent: 6224470 (2001-05-01), Hoey et al.
patent: 6280299 (2001-08-01), Kennedy et al.
patent: 6284092 (2001-09-01), Manfredi
patent: 6358124 (2002-03-01), Koga et al.
patent: 6398627 (2002-06-01), Chiou et al.
patent: 6551174 (2003-04-01), Brown et al.
patent: 6762135 (2004-07-01), Yang et al.
patent: 6846227 (2005-01-01), Sato et al.
patent: 2002/0119613 (2002-08-01), Yang et al.
patent: 2003/0190874 (2003-10-01), So
patent: 2005/0070215 (2005-03-01), Kim
patent: 10-296618 (1998-11-01), None
patent: 11-277411 (1999-10-01), None
patent: 2000-153460 (2000-06-01), None
patent: 2002-355759 (2002-12-01), None
patent: 2003-220554 (2003-08-01), None
patent: 2004-63888 (2004-02-01), None
patent: 2006-147773 (2006-06-01), None
patent: 2005005959 (2005-01-01), None
Optimization of CMP Pad Groove Arrays for Improved Slurry Transport, Wafer Profile Correction, and Defectivity Reduction; Gregory P. Muldowney, Advanced Research Group Rohm and Haas Electronic Materials CMP Technologies, Newark, DE 19713 USA; Feb. 23-25, 2005 CMP-MIC Conference 2005 IMIC-1000P/C/0156; pp. 156-167.
Japanese Office Action Corresponding to This Case Was Issued on Jun. 9, 2010 From the Japanese Patent Office. English Translation Attached.

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