Wafer polishing apparatus

Details Wafer polishing apparatus Wafer polishing apparatus

1994-09-16

1996-08-06

Rachuba, M.

Abrading

Machine

Rotary reciprocating tool

451160, 451289, B24B 700

Patent

active

055428746

ABSTRACT:
A wafer polishing apparatus has a wafer chuck for holding a wafer with a surface to be polished directed upward, the wafer chuck being rotatable by a wafer chuck rotation motor; a pair of nozzles for supplying slurries used as polishing solutions to the wafer; and a polishing head for holding a polishing cloth pad which is smaller in diameter than the wafer. The polishing head is rotated in the same direction as the wafer chuck by a polishing head rotation motor and is also reciprocally moved along the surface of the wafer to be polished by an arm driving motor. The wafer polishing apparatus also has a polishing head load adjusting air cylinder for pressing the polishing cloth pad against the wafer by way of the polishing head.

REFERENCES:
patent: 4128968 (1978-12-01), Jones
patent: 4232485 (1980-11-01), Eadon-Allen
patent: 4693036 (1987-09-01), Mori
patent: 4956944 (1990-09-01), Ando et al.
"Nitride-Masked Polishing (NMP) Technique for Surface Planarization of Interlayer-Dielectric Films", by Y. Hayashi et al., Japan Appln. Physics, vol. 32, No. 3A, Mar. 1993, pp. 1060-1063.

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