Wafer polishing apparatus

Details Wafer polishing apparatus Wafer polishing apparatus

1996-02-27

1996-12-17

Kisliuk, Bruce M.

Abrading

Machine

Rotary tool

451287, 451398, 451 41, B24B 500

Patent

active

055847510

ABSTRACT:
A wafer polishing apparatus increases the polishing uniformity by adjusting an abutting pressure of a retainer ting to an optimum value. A wafer holding head 32 of this apparatus has a head body 34, a carrier 46 provided within the head body 34, a retainer ring 50 arranged on the outer periphery of the carrier 46, a diaphragm 44 for pressing the carrier 46, a ring-shaped tube 54 which is made of an elastic material and mounted between the head body 34 and the retainer ring 50, and a second pressure regulating mechanism 60 for regulating a pressure of a fluid filled within the tube 54.

REFERENCES:
patent: 4519168 (1985-05-01), Cesna
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5449316 (1995-09-01), Strasbaugh

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