Wafer polishing apparatus

Details Wafer polishing apparatus Wafer polishing apparatus

2005-01-11

2005-01-11

Shakeri, Hadi (Department: 3723)

Abrading

Machine

Rotary tool

C451S398000, C451S288000, C451S388000

Reexamination Certificate

active

06840845

ABSTRACT:
The wafer polishing apparatus enables the control of proper polishing pressure, so that the quality of wafers can be maintained high. A wafer holding head is composed of a carrier for pressing the wafer against a polishing pad, a retainer ring at the circumference of the carrier, and a holding head body. The holding head body includes a carrier pressing device having an air bag of which pressing surface area is 50% or smaller of the area of the wafer, and the pressing force from the carrier pressing device is transmitted to the carrier.

REFERENCES:
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5762539 (1998-06-01), Nakashiba et al.
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 6113480 (2000-09-01), Hu et al.
patent: 6196905 (2001-03-01), Inaba
patent: 6273804 (2001-08-01), Numoto
patent: 6290577 (2001-09-01), Shendon et al.
patent: 6494774 (2002-12-01), Zuniga et al.
patent: 6585850 (2003-07-01), Kenji et al.
patent: 6663466 (2003-12-01), Chen et al.

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