Wafer polishing apparatus

Details Wafer polishing apparatus Wafer polishing apparatus

1998-07-09

2000-05-09

Eley, Timothy V.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 8, 451 9, 451 41, B24B 4900

Patent

active

060596368

ABSTRACT:
Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.

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patent: 5762539 (1998-06-01), Nakashiba
patent: 5797789 (1998-08-01), Tanaka et al.
patent: 5803799 (1998-09-01), Volodarsky et al.
patent: 5882243 (1999-03-01), Das et al.
patent: 5916009 (1999-06-01), Izumi et al.

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