Wafer polisher head used for chemical-mechanical polishing and e

Details Wafer polisher head used for chemical-mechanical polishing and e Wafer polisher head used for chemical-mechanical polishing and e

1996-01-17

1998-02-24

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

1566271, 1566361, 216 86, 216 88, H01L 21304, B24B 3704

Patent

active

057208450

ABSTRACT:
A polishing head is suitable for polishing a semiconductor wafer and for providing endpoint detection during chemical-mechanical polishing. The head features an arrangement of patterned active actuators and load cells above the wafer to fully control the wafer surface profile changes and provide endpoint detection during the polishing processes. Each active actuator applies pressure according to the local coated thin film thickness on the wafer and relative velocity between the wafer and polishing pad. The load cell senses the actual force pressing on the wafer and feeds the information back to the actuator to adjust the force to a preset value, The planar endpoint is detected by sensing a change in friction force between different thin film material on the wafer. The change in friction force is detected by the load cell and a signal is produced to adjust or stop the process.

REFERENCES:
patent: 4606151 (1986-08-01), Heynacher
patent: 4873792 (1989-10-01), Linke et al.
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5321304 (1994-06-01), Rostoker
patent: 5472374 (1995-12-01), Yamada

Affiliated with

Also associated with

Rating

Wafer polisher head used for chemical-mechanical polishing and e does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer polisher head used for chemical-mechanical polishing and e, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer polisher head used for chemical-mechanical polishing and e will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1872828