Wafer planarization composition and method of use

Details Wafer planarization composition and method of use Wafer planarization composition and method of use

2006-02-14

2006-02-14

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S036000, C451S057000, C451S063000, C451S285000, C451S287000, C438S692000, C156S345120

Reexamination Certificate

active

06997785

ABSTRACT:
A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.

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