Wafer Pattern imaging apparatus

Details Wafer Pattern imaging apparatus Wafer Pattern imaging apparatus

1999-05-13

2000-07-11

Banks, Derris H.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 6, B24B 4900, B24B 5100

Patent

active

060864532

ABSTRACT:
Even if it is impossible to image a pattern surface of a wafer that is placed with its down on a wafer table with visible light, a wafer pattern imaging apparatus is able to image the pattern surface (the obverse) from the reverse of the wafer with light transmitted through the wafer. The obverse of the wafer, made of silicon, is attached to a wafer sheet to protect the obverse of the wafer, on which patterns are formed. An infrared camera, which images an image formed by infrared light, and an infrared light source, which emits the infrared light to the wafer, are disposed above the wafer table. A mirror for reflecting the infrared light is disposed in the wafer table. The infrared light emitted from the infrared light source is transmitted through the wafer. Then, the infrared light is reflected on the mirror, and the reflected infrared light illuminates the pattern surface of the wafer. The infrared camera images the images of the pattern surface.

REFERENCES:
patent: 4407262 (1983-10-01), Wirz et al.
patent: 5353551 (1994-10-01), Nishida
patent: 5417791 (1995-05-01), Beeteson et al.
patent: 5433649 (1995-07-01), Nishida
patent: 5668061 (1997-09-01), Herko et al.

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