Wafer packaging system

Details Wafer packaging system Wafer packaging system

1976-09-07

1978-05-30

Price, William

Special receptacle or package

Including ancillary article contacting medium

Gas medium

206309, 206332, 206334, 206445, 206454, 2065248, 206586, 206593, 220337, B65D 8124, B65D 2512

Patent

active

040919196

ABSTRACT:
A wafer packaging system for clean packaging and damage-free transporting of semiconductor wafers. The system includes tubular outer and inner containers, the inner container adapted to be contained by the outer container with the longitudinal axes of both containers extending in the same axial direction. The inner container includes provision for holding a plurality of the semiconductor wafers in spaced face-to-face relationship. The system provides a sealed container arrangement preventing contaminants outside the outer container from contaminating wafers within the inner container. Shock-absorbing features associated with the containers prevent shocks applied to the outer container from damaging the wafers.

REFERENCES:
patent: 2284551 (1942-05-01), Alexander
patent: 2943731 (1960-07-01), Brown
patent: 3048668 (1962-08-01), Weiss
patent: 3059830 (1962-10-01), Kramer
patent: 3365092 (1968-01-01), Blessing
patent: 3400809 (1968-09-01), Puente
patent: 3472568 (1969-10-01), Southwick
patent: 3531040 (1970-09-01), Myny
patent: 3607440 (1971-09-01), Fred et al.

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