Wafer packaging system

Details Wafer packaging system Wafer packaging system

1978-11-03

1979-10-23

Moy, Joseph Man-Fu

Special receptacle or package

Including ancillary article contacting medium

Gas medium

206445, 206454, 206583, 206561, 206565, 220 4B, 220410, B65D 134, B65D 8530

Patent

active

041717406

ABSTRACT:
A wafer packaging system for clean packaging and damage-free transporting of semiconductor wafers. The system includes tubular outer and inner containers, the inner container adapted to be contained by the outer container with the longitudinal axes of both containers extending in the same axial direction. The inner container includes provision for holding a plurality of the semiconductor wafers in spaced face-to-face relationship. The system provides a sealed container arrangement preventing contaminants outside the outer container from contaminating wafers within the inner container. Shock-absorbing features associated with the containers prevent shocks applied to the outer container from damaging the wafers.

REFERENCES:
patent: 2284551 (1942-05-01), Alexander
patent: 2384042 (1945-09-01), O'Brien
patent: 2389312 (1945-11-01), Honza
patent: 2642987 (1953-06-01), Castelli
patent: 3048668 (1962-08-01), Weiss
patent: 3229809 (1966-01-01), Spadaro
patent: 3379303 (1968-04-01), Jenkins
patent: 3400809 (1968-09-01), Puente
patent: 3467242 (1969-09-01), Rousse
patent: 3607440 (1971-09-01), Fred et al.
patent: 3710900 (1973-01-01), Fink
patent: 3860116 (1975-01-01), Castine, Jr.
patent: 3926305 (1975-12-01), Wallestad

Affiliated with

Also associated with

Rating

Wafer packaging system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer packaging system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer packaging system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-406695