Wafer packaging method

Details Wafer packaging method Wafer packaging method

2008-01-25

2010-06-15

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257SE21505

Reexamination Certificate

active

07736952

ABSTRACT:
A wafer packaging method is disclosed.An aspect of the invention is to provide a wafer packaging method comprising;attaching tape onto one side of a carrier, the carrier having a through-hole formed therein; attaching a wafer onto the tape exposed inside the through-hole such that at least one electrode of the wafer is exposed; andperforming a packaging process on the carrier such that the wafer is packaged.

REFERENCES:
patent: 2001/0026021 (2001-10-01), Honda
patent: 2001/0055856 (2001-12-01), Tao
patent: 2004/0099943 (2004-05-01), Meguro et al.
patent: 2006/0073638 (2006-04-01), Hsu
patent: 2008/0048310 (2008-02-01), Zeng
patent: 11-307624 (1999-11-01), None
patent: 2006-0007846 (2006-01-01), None
Korean Office Action issued Aug. 31, 2009 in corresponding Korean Patent Application No. 10-2007-0098379.

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