Wafer packaging and singulation method

Details Wafer packaging and singulation method Wafer packaging and singulation method

2006-04-11

2006-04-11

Dang, Trung (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C438S119000

Reexamination Certificate

active

07026189

ABSTRACT:
A method for packaging and singulating a wafer having a plurality of micro devices includes providing a multi-lid substrate having a trench having intersection portions and non-intersection portions formed on a first side of the multi-lid substrate. The multi-lid substrate is coupled to the wafer such that the intersection portions of the trench pattern extend adjacent to at least three micro devices. Portions of the multi-lid substrate between a second side of the multi-lid substrate and the trench pattern are removed while the multi-lid substrate is coupled to the wafer.

REFERENCES:
patent: 6055344 (2000-04-01), Fouquet et al.
patent: 6265246 (2001-07-01), Ruby et al.
patent: 6465355 (2002-10-01), Horsley
patent: 6503780 (2003-01-01), Glenn et al.
patent: 6537846 (2003-03-01), Lee et al.
patent: 6583524 (2003-06-01), Brandt
patent: 6590850 (2003-07-01), Eldredge et al.
patent: 6600201 (2003-07-01), Hartwell et al.
patent: 6632698 (2003-10-01), Ives
patent: 6777263 (2004-08-01), Gan et al.
patent: 6787897 (2004-09-01), Geefay et al.
patent: 6900509 (2005-05-01), Gallup et al.
patent: 2002/0170175 (2002-11-01), Aigner et al.
IMAPS Advanced Technology Workshop on Packaging on MEMS and Related Micro Integrated Nano Systems, Workshop Presentations, Hilton San Jose South/Scotts Valley, Scotts Valley, CA, Nov. 8-10, 2001.

Affiliated with

Also associated with

Rating

Wafer packaging and singulation method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer packaging and singulation method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer packaging and singulation method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3550827