Wafer orienting apparatus

Details Wafer orienting apparatus Wafer orienting apparatus

1979-06-29

1980-12-30

Nase, Jeffrey V.

Material or article handling

Article reorienting device

Article reoriented by contact with fluid means

406 87, 414786, B65G 5102, B65G 4724

Patent

active

042420385

ABSTRACT:
An apparatus and method for orienting a substantially flat wafer are described. The wafer preferably has two flat registration edges of unequal length. Upon contact of any edge portion of the wafer with a sensor projecting forwardly from one registration surface, air jets are activated to rapidly rotate the wafer one way until the longer of its two registration edges contacts a sensor projecting forwardly from another registration surface. Then air jets are activated to slowly rotate the wafer the opposite way until said longer registration edge contacts another sensor associated with said other registration surface to effect precise registration of the wafer without overshoot as all three sensor are concurrently contacted and activated. Wafer movement by the jets thereupon terminates and vacuum is applied continuously to hold the wafer in place while the work operation is performed thereon. Since the wafer is registered solely by contact with the various sensor (and not by contact with the respective registration surfaces), contamination of the wafer by physical contact is minimized.

REFERENCES:
patent: 3890508 (1975-06-01), Sharp
patent: 3930684 (1976-01-01), Lasch et al.
patent: 4024944 (1977-05-01), Adams et al.

Affiliated with

Also associated with

Rating

Wafer orienting apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer orienting apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer orienting apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-5193