Wafer orientation system

Material or article handling – Apparatus for moving material between zones having different... – For carrying standarized mechanical interface type

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414222, 414417, 118729, 118730, B65H 100

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active

044988338

ABSTRACT:
Apparatus for programmably orienting a semiconductor wafer in an ion implantation system so as to limit channeling or to control the depth of penetration of impinging ions. The apparatus is associated with a processing chamber door and includes a rotatable vacuum chuck for engaging the wafer and a motor for rotating the vacuum chuck and the wafer through a preselected angular displacement. The apparatus further includes a programmable control assembly operative to deenergize the motor upon sensing rotation of the vacuum chuck through the preselected angular displacement. The wafer orientation apparatus is typically utilized in a system for the vertical transfer of wafers between a cassette and a processing chamber.

REFERENCES:
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Gruber, L. W. and Mustis, B.; Wafer Chuck Air Flow; IBM Technical Disclosure Bulletin; vol. 18, No. 6; Nov., 1975.
Hoebener, K. G.; Multiple Size Chip Pickup and Placement Station; IBM Technical Disclosure Bulletin; vol. 22, No. 7; Dec., 1979.
Chu et al., "Backscattering Spectrometry," Academic Press, New York, 1978, pp. 223-229.

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