Wafer orientation alignment system

Coating apparatus – Gas or vapor deposition

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

117 85, 118720, 20419213, C23C 3600

Patent

active

056907443

ABSTRACT:
An apparatus and method for precisely calibrating the transfer arm of a multiple station wafer processing system without breaking vacuum and with a minimum of system downtime is provided. A system of determining and properly aligning the crystallographic orientation of the wafers before processing as well as monitoring the orientation of individual wafers during wafer transfer between processing stations is also provided.

REFERENCES:
patent: 3838028 (1974-09-01), Needham et al.
patent: 4816133 (1989-03-01), Barnett
patent: 4819167 (1989-04-01), Cheng et al.
patent: 4833790 (1989-05-01), Spencer et al.
patent: 5102280 (1992-04-01), Poduje et al.
patent: 5281320 (1994-01-01), Turner et al.
patent: 5483138 (1996-01-01), Smookler et al.
patent: 5511005 (1996-04-01), Abbe et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wafer orientation alignment system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer orientation alignment system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer orientation alignment system will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2103206

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.