Wafer mounting structure for pickup tube

Details Wafer mounting structure for pickup tube Wafer mounting structure for pickup tube

1974-09-09

1978-07-25

Segal, Robert

Electric lamp and discharge devices

Cathode ray tube

Image pickup tube

313366, H01J 3138, H01J 2902

Patent

active

041032039

ABSTRACT:
A thin target wafer of silicon includes a light receiving surface which is mounted to an inner faceplate surface of a pickup tube envelope by an interposed region of transparent adhesive. The peripheral edge of the adhesive is sealed by a conductive sealant material to substantially prevent outgassing of the adhesive within the interior of the envelope. In one embodiment, a conductive sealant material is provided by which electrical contact from the wafer to an electrical connector, extending external to the envelope, is established.
A method of assembly of the wafer with the faceplate is provided wherein residual bubbles of the interposed flowable adhesive are substantially collapsed by assembly of the wafer and the faceplate in a vacuum, and, thereafter, exposing the wafer-faceplate assembly to atmospheric pressure.

REFERENCES:
patent: 3256455 (1966-06-01), Saldi
patent: 3350595 (1967-10-01), Kramer
patent: 3458782 (1969-07-01), Buck et al.
patent: 3569758 (1971-03-01), Horiuchi et al.
patent: 3576392 (1971-04-01), Hofstein
patent: 3725711 (1973-04-01), Sadler
patent: 3793571 (1974-02-01), Janssen
patent: 3814965 (1974-06-01), Matsumura et al.
patent: 3887827 (1975-06-01), Katayama
patent: 3899709 (1975-08-01), Brown et al.
Engstrom et al., "The Silicon Return-Beam Vidicon - A High Resolution Camera Tube", RCA Review, vol. 33, Sep., 1972, pp. 501-516.

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