Wafer mounting device

Details Wafer mounting device Wafer mounting device

1992-06-25

1998-02-24

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

156556, 1565831, 100259, 100265, 269 21, B65C 908

Patent

active

057208492

ABSTRACT:
A wafer mounting device transfers a wafer coated with an adhesive and pastes the wafer on a mount plate while maintaining the thickness of the adhesive uniform. A chuck plate is carried by a rotatable transfer arm and holds the adhesive-coated wafer by suction so that the wafer can be moved in a direction of rotation of the arm. The chuck plate is heated by a heater to substantially the same temperature as the wafer. A flexible pressing pad is disposed between the chuck plate and the transfer arm for biasing the chuck plate in a direction away from the arm, and a flexible pressure-adjusting pad is provided for biasing the chuck plate in a direction toward the arm. The pressing pad and the pressure-adjusting pad have hollow sections filled with pressurized fluid, and the pressure of the fluid within each pad is regulated to thereby control the pressing force of the chuck plate so that the wafer is placed softly on the mount plate.

REFERENCES:
patent: 4540460 (1985-09-01), Blomquist et al.
patent: 4960485 (1990-10-01), Ichinose et al.
patent: 4966639 (1990-10-01), Pfeffer et al.
patent: 4980002 (1990-12-01), Dzarnoski, Jr. et al.

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