Wafer matching methods for use in assembling micromirror...

Semiconductor device manufacturing: process – Including control responsive to sensed condition – Interconnecting plural devices on semiconductor substrate

Reexamination Certificate

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C257SE21499

Reexamination Certificate

active

10875987

ABSTRACT:
The invention provides a method for matching micromirror wafers and electrode wafers so as to form micromirror array devices while the production yield is maximized. Each micromirror wafer and/or electrode wafer may have one or more non-passing dies and a plurality of good dies. A set of matching schemes are defined for matching each micromirror wafer with an electrode wafer. For each matching scheme, a cost is calculated with the cost being defined as a total number of unmatched die assemblies resulted from the matching scheme, wherein the unmatched die assembly is defined as an assembly consisting of a passing and non-passing die. Then a matching scheme is selected from the defined matching scheme such that the calculated cost is the minimum among the calculated costs of the defined matching schemes.

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