Semiconductor device manufacturing: process – Including control responsive to sensed condition – Interconnecting plural devices on semiconductor substrate
Reexamination Certificate
2008-05-27
2008-05-27
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Interconnecting plural devices on semiconductor substrate
C257SE21499
Reexamination Certificate
active
10875987
ABSTRACT:
The invention provides a method for matching micromirror wafers and electrode wafers so as to form micromirror array devices while the production yield is maximized. Each micromirror wafer and/or electrode wafer may have one or more non-passing dies and a plurality of good dies. A set of matching schemes are defined for matching each micromirror wafer with an electrode wafer. For each matching scheme, a cost is calculated with the cost being defined as a total number of unmatched die assemblies resulted from the matching scheme, wherein the unmatched die assembly is defined as an assembly consisting of a passing and non-passing die. Then a matching scheme is selected from the defined matching scheme such that the calculated cost is the minimum among the calculated costs of the defined matching schemes.
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Rubinstein Y. Dan
Singhal Anoop
Brady III Wade James
Lebentritt Michael
Stevenson André
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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