Wafer-like processing after sawing DMDs

Details Wafer-like processing after sawing DMDs Wafer-like processing after sawing DMDs

1993-06-24

1995-08-29

Rachuba, Maurina T.

Abrading

Work holder

Vacuum

451390, B24B 4106

Patent

active

054455596

ABSTRACT:
A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the wafer 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32. Each device 32 is held on the fixture by a vacuum in the headspace above the device 32. In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.

REFERENCES:
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patent: 4184292 (1980-01-01), Defasio et al.
patent: 4213698 (1980-07-01), Firtion et al.
patent: 4669226 (1987-06-01), Mandler
patent: 5029418 (1991-07-01), Bull
patent: 5291692 (1994-03-01), Takahashi et al.

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