Wafer-like processing after sawing DMDs

Details Wafer-like processing after sawing DMDs Wafer-like processing after sawing DMDs

1995-01-12

1997-04-22

Breneman, R. Bruce

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

156268, H01L 21302

Patent

active

056229003

ABSTRACT:
A method of fabricating debris intolerant devices 30, and especially micro-mechanical devices such as DMDs, that allows wafers 22 to be sawn prior to completing all fabrication steps. Some devices are too fragile to allow cleaning operations to be performed after fabrication of the device. A solution is to saw and clean the wafers prior to completing the fabrication steps that make the device fragile. To prevent having to process the chips 30 individually, a substrate wafer 28 is attached to the backside of the dicing tape 24. This substrate wafer holds the sawn chips 30 in alignment allowing the remaining fabrication steps to be performed in wafer form.

REFERENCES:
patent: 5061049 (1991-10-01), Hornbeck
patent: 5083234 (1992-01-01), Lehto et al.
patent: 5358590 (1994-10-01), Yamanaka
patent: 5386142 (1995-01-01), Kurtz et al.
patent: 5459081 (1995-10-01), Kajita

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