Wafer level packaging structure with inductors and...

Details Wafer level packaging structure with inductors and... Wafer level packaging structure with inductors and...

2006-12-15

2008-10-14

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S759000, C361S802000, C361S756000

Reexamination Certificate

active

07436683

ABSTRACT:
A wafer level packaging structure with inductors and manufacture method thereof. The method comprises providing a substrate, having several inductors, forming conductive lines and holes to connect the inductors and the wafer, and bonding the substrate and the wafer via bonding pads. Therefore, there are air gaps between the inductors and the wafer, thereby reducing the inductor's dispassion loss and increasing the inductor's quality factor. In addition, the inductors having a high quality factor can be integrated in the wafer containing active/passive components.

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