Wafer-level packaging of optical receivers

Details Wafer-level packaging of optical receivers Wafer-level packaging of optical receivers

2005-10-18

2005-10-18

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S026000

Reexamination Certificate

active

06955934

ABSTRACT:
A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

REFERENCES:
patent: 5940564 (1999-08-01), Jewell
patent: 5981945 (1999-11-01), Spaeth et al.
patent: 6243508 (2001-06-01), Jewell et al.

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