Wafer level packaging method

Details Wafer level packaging method Wafer level packaging method

2011-07-05

2011-07-05

Menz, Laura M (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C438S118000, C438S401000, C438S462000, C438S465000, C438S464000, C257SE21503, C257SE21599, C257SE23179, C257SE21499

Reexamination Certificate

active

07972904

ABSTRACT:
A wafer level packaging method is revealed. Firstly, a wafer with a plurality of bumps disposed on a surface is provided. Placing a dielectric tape on a mold plate is followed. Then, the wafer is laminated with the mold plate to make the dielectric tape be compliantly bonded to the surface of the wafer and to make the bumps be embedded in the dielectric tape. After removing the mold plate, flattening the dielectric tape to form a plurality of exposed surfaces of the bumps wherein the exposed surfaces and the flattened surface of the dielectric tape are coplanar. Therefore, the exposed surfaces of the bumps can be regarded as effective alignment points for easy pattern recognition of the wafer level packaged wafers during singulation process.

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