Wafer level packaging image sensor module having lens...

Details Wafer level packaging image sensor module having lens... Wafer level packaging image sensor module having lens...

2011-07-19

2011-07-19

Mandala, Victor A (Department: 2826)

Optical: systems and elements

Lens

With support

C438S064000, C438S065000, C257SE31127

Reexamination Certificate

active

07982982

ABSTRACT:
Disclosed herein is a wafer level packaging image sensor module, including a wafer including an image sensor, a circuit portion and a lower electrode on one side thereof, a lens actuator disposed on the lower electrode and made of electroactive polymer, an upper electrode disposed on the lens actuator, and a lens unit disposed on the upper electrode to allow light to be transmitted to the image sensor therethrough. The wafer level packaging image sensor module includes the lens actuator made of electroactive polymer, and thus it enables realization of the autofocusing of the wafer level packaging image sensor module.

REFERENCES:
patent: 2006/0028743 (2006-02-01), Yamashita et al.
patent: 2008/0054155 (2008-03-01), Klein
patent: 2008/0204909 (2008-08-01), Shiota et al.
patent: 2006309112 (2006-11-01), None
Korean Office Action dated Jul. 26, 2010 in corresponding Korean Patent Application.

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